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Due to the sticky nature of flux, it also acts as an adhesive and holds SMT devices in place before a permanent bond is formed. Flux ensures cleaning of pads i.e., removing oxides and impurities, and wetting of molten solder. Solder paste is an amalgam of flux and solder. Most importantly, SMT devices do not require conventional soldering procedures, instead they use reflow soldering process which allows for the ease of automation.įirst step in solder reflow process is the application of solder paste on metal pads. Therefore, SMT devices have emerged as the popular choice among modern electronics manufacturers. Moreover, since SMT components can be soldered to both sides of PCB, achieving high board density becomes easier as compared to through-hole components. Geometrically, SMT devices are smaller in size, which makes PCB miniaturization achievable and they reduce spurious inductances and capacitances which makes PCBA less vulnerable to Electromagnetic Interference (EMI) thus increasing overall system reliability. SMT has been able to provide them with all these luxuries. Owing to an increase in market competition, modern electronics manufacturers are focusing on optimizing the cost, size, and manufacturing process of electronics assemblies. Some state-of-the-art products of Techspray will be highlighted to aid engineers to achieve optimal reflow profiles and fault-free PCBAs.
REFLOW PROFILE HOW TO
To educate PCB design engineers, this article aims to elaborate how to achieve optimal solder reflow profiles and avoid common Printed Circuit Board Assembly (PCBA) defects, e.g., bridging, tombstoning, beading, and cracking during manufacturing. With the increasing use of Surface Mount Technology (SMT) most defects in new electronics assemblies are credited to unoptimized solder reflow profiles. D:20050615183953 Acrobat PDFMaker 6.Faulty or damaged electronics assemblies obtained after batch processing is a big setback for not only the electronics manufacturers who are competing in the market, but also for the process engineers. 3 cycle Max.)/RD/Type/Annot/AP/BE>endobj147 0 objendobj148 0 obj/Type/XObject/BBox/FormType 1>streamĮndstreamendobj149 0 obj/Type/XObject/BBox/FormType 1>streamĮndstreamendobj150 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj151 0 obj/Type/XObject/BBox/FormType 1>streamĮndstreamendobj152 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj153 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj154 0 objendobj155 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj156 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj157 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj159 0 obj/Type/XObject/BBox/FormType 1>streamĮndstreamendobj160 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj161 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj162 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj163 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj164 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj165 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj166 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj167 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj168 0 objendobj169 0 ~�^aڻx��R�o����B�ޫ�e��C�+��ӯ�e����bp��6 �ك�- �=bd�Ĺ�̚�Y��8�Є�yx��m�O�of���r�QY��+streamĪcrobat Distiller 6.0.1 (Windows) KOA Speer Electronics, Inc.
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